Senior Digital IC Design Engineer

ams International AG — Rapperswil
14.08.2019Fach­verantwortung100%

Senior Digital IC Design Engineer

Senior Digital IC Design Engineer

Job no.

004638

Position Type

Research & Development

Working time

  • Regular Fulltime

Place of employment

Rueschlikon

What we offer:

Your tasks and responsibilities

  • • High level of proficiency in design flow, state machine design, synchronization, event driven simulations, STA, design-for-test (DfT), place and route (PnR), ATPG, CDC
  • • Experience in design verification, clock gating / clock tree design, multiple power domains, mixed signal interface, I2C, Perl or Python
  • • Digital, Analog/Mixed-Signal Circuit design, simulation and verification of complex system-on-chip
  • • Internal team leadership and communication, coordination of design requirements and tradeoffs, preparation for weekly meetings (internal and customer)
  • • Technical communication with customer (and/or marketing) and other work-packages, including: presentation in design reviews, test requirements, defining / tracking / working to ensure schedule adherence, interactive problem solving and customer communication under pressure.
  • • Experience with EM/IR: Voltus or Apache RedHawk is preferred
  • • Create and patent new IPs, Supervise junior engineers
  • • Ability to perform digital design verification in a UVM environment is a plus

Your education and experiences

  • • MSc. in Electrical Engineering with 10 years of experience – emphasis in Digital Integrated Circuit Design or similar
  • • Proved experience and technical leadership in Digital IC Design, simulation, modelling, timing analysis and verification
  • • Solid experience in digital IC design and simulations SW tools (Cadence, Synopsys)
  • • Profound understanding of RTL design in VHDL, simulation, synthesis, and place & route of digital building blocks
  • • Familiarity with on-chip bus architectures, embedded processors, software and hardware debug support and modelling data flows at the chip level including mixed-signal circuits modelling
  • • Familiarity with the major semiconductor process nodes
  • • Experience in system design for 3D imaging systems and image sensors will be an advantage
  • • Assertive team player, able to solve complex problems under high pressure in a complex environment
  • • Able to communicate effectively and to the point in front of customers and internal stakeholders

30 Jobs — Rapperswil

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