YOUR CHALLENGES

In order to reduce the time-to-market of our advanced sensors products, we are looking to bolster our competence in the domain of semiconductor-compatible packaging and integration solutions for advanced vacuum sensors.

• Lead the development of next generation advanced sensor packaging solutions adhering to complex requirements
• Develop sensor integration concepts and drive sensor packaging industrialization projects
• Collaboration with external competence centers and industrialization partners
• Evaluate existing low-volume packaging & assembly solutions and implement required improvements
• Join a multi-location R&D organization (Haag, Zürich)

YOUR COMPETENCIES

• MSc or PhD degree in mechanical engineering, electrical engineering, physics or related discipline
• 5+ years of industry experience on mechanical design-related topics
• Experience in MEMS/IC/photonics packaging technologies and assembly process methodologies
• Experience with data analysis in Matlab or Python is a plus
• Negotiating skills in English and German (fluent in spoken and writing)
• Work experience in vacuum technology / semiconductors / MEMS beneficial

You can showcase success stories in multi-disciplinary design projects and are highly motivated to work in an agile and innovative environment. You are used to working independently, proactively and in an organized manner. You have a strong ability to work in a team and care about interdisciplinary interface functions.